台積電獲英特爾雙料訂單　首度通吃CPU、GPU代工

台湾半导体很猛啊，以前INTEL介入GPU市场大家总认为凭借INTEL的制程优势， AMD和NVIDIA之类靠台湾代工的将无法跟INTEL抗衡。

现在台湾半导体制程和成本上甚至比INTEL原厂还有优势

bigKprocess 发表于 2009-9-26 03:34

成本优势，制程上INTEL可不是WW可比

intel大手大脚惯了，不习惯拼成本

也就是Atom这类的低端处理器罢了。

intel的那个显卡也让台积电弄。。。。希望不要搞出500W的火炉子出来。台积电的工艺跟intel比起来太差了。

从来不觉得台巴子的半导体有什么NB的，别的不说，先发这么多年了运放电源管理还干不过大陆公司。

larrabee给台积电做？OK，我对larrabee彻底死心了。

首先我要承认Intel在全球半导体界工艺上老大哥的位置
这个是在目前Bulk领域绝对的第一

但是...不知楼上的兄弟有什么直接证据证明：“台积电的工艺跟intel比起来太差了”？？

还是没有调查就想当然的
有什么证据能证明

差距肯定是有的
但是有你们说的这么大吗？？

首先我要承认Intel在全球半导体界工艺上老大哥的位置
这个是在目前Bulk领域绝对的第一

但是...不知楼上的兄弟有什么直接证据证明：“台积电的工艺跟intel比起来太差了”？？

还是没有调查就想当然的
有什么证据能证明

差距肯定是有的
但是有你们说的这么大吗？？

zhutou6 发表于 2009-9-26 13:15

对于工艺制造来说
没有高低端
一样的工艺，就要达到一样的品质

lilun0080 发表于 2009-9-26 16:29

现AMD/Nvida 40nm工艺的GPU的显卡都是从TSMC出来的
请问你现在的电脑显卡500W功率？？

意料之外，情理之中

TW就这点很可以

INTEL的那个larrabee，用intel的45nm工艺都是个300W以上的路子，台积电的发热量只会更高。

YY文，鉴定完毕{:3_77:}

鄙视台湾媒体{:3_77:}

Larrabee从来没有说交由台积电代工，台湾人无耻之极，台积电代工的是ATOM 客制化SOC而不是CPU，真是不要脸到了极点不知道天天造假新闻，DIGITIMES还要不要脸，台媒分不清Langwell和Larrabee{:3_77:}
这才是Larrabee的真相
Intel has used the Developer Forum (IDF) to launch its new series of products. Intel unveiled one of the smallest microchips as it showcased the first working model of a 22 nm SRAM chip. The chip contains three billion transistors packed into a small area the size of a finger nail.

The display of the 22 nm SRAM chip by Intel has left many analysts who believed chips cannot get any smaller, baffled. Intel, however, promises that smaller chips are yet to come.
Intel also used the event to reveal its multi-core graphics system. The graphics system is named Larrabee and was unveiled by Intel senior research scientist Bill Marks.Unveiling Larrabee, Marks said: "I am very excited about what it’s going to do, and it’s really great to have the hardware up and running."
To display the power of the graphics processing unit, Intel gave a demonstration by running the game Enemy Territory: Quake Wars powered by a multi-core (six) 32nm Gulftown processor.

Intel wanted to demonstrate, particularly, the capability of ray tracing in real time. It allows the interaction of light and matter in a realistic and accurate way.

Intel’s chief, Paul Otellini, in his keynote speech said that software is the key in enabling a smooth co-working of numerous electronics devices such as netbooks, smartphones, plasma TVs, etc. Intel has aggressive sought after the software side through the acquisition of 10 software companies.

In the IDF, Intel displayed its Moblin 2.1 operating system for phones. It is the updated version of Intel’s Linux based operating system. The OS supports easy multi tasking and there is a possibility the OS would be used for Netbooks also. It uses Silverlight and can hence allow applications to run within browsers, something that iPhone cannot do currently.

Intel also launched the Intel Atom Developer Program to allow developers to write applications dedicated for the lower powered Intel Atom processors. Most of the Netbooks are powered by the Atom processor chips.
The program will encourage developers to use run times such as Silverlight that enable applications to be executable in Windows and in Moblin 2.1 OS.

YY文，鉴定完毕{:3_77:}

鄙视台湾媒体{:3_77:}

Larrabee从来没有说交由台积电代工，台湾人无耻之极，台积电代工的是ATOM 客制化SOC而不是CPU，真是不要脸到了极点不知道天天造假新闻，DIGITIMES还要不要脸，台媒分不清Langwell和Larrabee{:3_77:}
这才是Larrabee的真相
Intel has used the Developer Forum (IDF) to launch its new series of products. Intel unveiled one of the smallest microchips as it showcased the first working model of a 22 nm SRAM chip. The chip contains three billion transistors packed into a small area the size of a finger nail.

The display of the 22 nm SRAM chip by Intel has left many analysts who believed chips cannot get any smaller, baffled. Intel, however, promises that smaller chips are yet to come.
Intel also used the event to reveal its multi-core graphics system. The graphics system is named Larrabee and was unveiled by Intel senior research scientist Bill Marks.Unveiling Larrabee, Marks said: "I am very excited about what it’s going to do, and it’s really great to have the hardware up and running."
To display the power of the graphics processing unit, Intel gave a demonstration by running the game Enemy Territory: Quake Wars powered by a multi-core (six) 32nm Gulftown processor.

Intel wanted to demonstrate, particularly, the capability of ray tracing in real time. It allows the interaction of light and matter in a realistic and accurate way.

Intel’s chief, Paul Otellini, in his keynote speech said that software is the key in enabling a smooth co-working of numerous electronics devices such as netbooks, smartphones, plasma TVs, etc. Intel has aggressive sought after the software side through the acquisition of 10 software companies.

In the IDF, Intel displayed its Moblin 2.1 operating system for phones. It is the updated version of Intel’s Linux based operating system. The OS supports easy multi tasking and there is a possibility the OS would be used for Netbooks also. It uses Silverlight and can hence allow applications to run within browsers, something that iPhone cannot do currently.

Intel also launched the Intel Atom Developer Program to allow developers to write applications dedicated for the lower powered Intel Atom processors. Most of the Netbooks are powered by the Atom processor chips.
The program will encourage developers to use run times such as Silverlight that enable applications to be executable in Windows and in Moblin 2.1 OS.

继续真相
Langwell由TMSC代工
Moorestown作为集成CPU组合I/O芯片的「第二代芯片(2nd Chip)」，会由现在的Menlow「Intel System Controller Hub US15W(Poulsbo)」变为「Langwell」。Moorestown作为Lincroft和Langwell的双芯片解决方案。 Langwell不是在Intel的制造而是由TSMC代工。对此Chandrasekher先生介绍:

　　基于Langwell应对市场要求的功能。我们确定了与手机厂商以及家电厂商的协议结果，他们要求的IP块与Intel现有的东西多少有些差异。因此决定第二芯片由TSMC代工。说到原因是由于TSMC拥有很多的(我们顾客需要的)IP。

这表示Intel还无法满足顾客的需求，因此就将芯片组交由TSMC生产。而且Lincroft合并了功能的Moorestown与以前的Menlow相比在功耗上也成功下降了许多。

一些“有良心”的台湾人说：
Intel 並沒有要下單給 tsmc. 它只是把 Atom 轉移至 tsmc OIP 平台, 讓之後想利用 Atom 矽智財來做單晶片的廠商, 能夠在 tsmc 生產. (因為 Intel 沒有做代工). 基本上, 這是互惠的機制, 同時也是 Intel 用來圍剿 ARM 等矽智財的策略.

Joint Intel/TSMC announcement

By now many of you have seen news coverage of the announcement that Intel and TSMC have signed an MOU (memorandum of understanding) under which Intel and TSMC would collaborate on future Atom processor-based SOC solutions. I wanted to take just a moment and try to clarify what was agreed to.

Some of this is a bit technical, but I will try to explain as plainly as I can.

First...what this deal is:

An agreement consistent with this MOU would allow TSMC to build Atom-based SOCs (system-on-chip, which is a highly integrated piece of silicon that can do a multitude of tasks) for Intel customers using our Atom SOC cores combined with TSMC's existing intellectual property. The combination of these technologies would allow Intel to jumpstart its SOC business by filling some gaps in our technology portfolio that are necessary for adoption into the markets we are targeting. It is important to note that these designs would be for Intel customers and will be handled by Intel. Intel designers would design Atom SOC designs to TSMC process technology (specific details on that are not public) and couple those designs with TSMC-licensed technology. This agreement would not be specific for Netbooks or for handhelds but for all end market segments that would benefit from and demand the characteristics of an SOC (Embedded, CE, handhelds, Netbooks/Nettops). Intel believes that the performance and software compatibility of Atom-based SOC coupled with intellectual property elements necessary to offer a broad range of end products for our customers' needs would result in compelling solutions.

This is not a capacity outsource deal nor is this a process technology transfer. As stated above, Intel designers will port the Atom designs to a leading-edge TSMC process to allow Atom SOC cores to be coupled with added TSMC IP. This arrangement is also not an open license for TSMC to go out and market Atom-based devices on its own. All manufacturing in this arrangement is for Intel customers and with Intel products. Intel will control the terms of how and where these products will be sold and marketed.
What Intel gains from this deal:

Today, Intel does not possess some of the intellectual property that customers require for certain applications and market segments. Up until now, Intel's business model has been tuned to service the general-purpose computing market segment and not custom or semi-custom silicon applications. Over time, we expect to develop much of that capability, but porting such IP to the current Intel manufacturing flows will take time. This collaboration has the effect of jumpstarting our business opportunities by closing important technology gaps and broadening the Atom ecosystem. As you think about the progression of Moore's law--the fundamental driver of our business model--moving into system-on-chip products is a natural evolution where we can use our transistor budget to perform more and more functions on the same silicon as the CPU. This has the effect of lowering cost, improving performance, and reducing power consumption.

What TSMC gains from this agreement:
I don't want to speak for TSMC so I would encourage questions about TSMC specifically to go to them. The Intel response to this question is that TSMC would get to participate in the build-out of the Atom business, which we believe will be a substantial volume business over the next several years. Atom is already off to a very positive start, and as we continue to power-reduce this product and offer it in more integrated SOC solutions, the business opportunity will continue to expand. TSMC would have an opportunity to benefit from that expansion as TSMC helps build products around the ported Atom processor core.

Joint Intel/TSMC announcement

By now many of you have seen news coverage of the announcement that Intel and TSMC have signed an MOU (memorandum of understanding) under which Intel and TSMC would collaborate on future Atom processor-based SOC solutions. I wanted to take just a moment and try to clarify what was agreed to.

Some of this is a bit technical, but I will try to explain as plainly as I can.

First...what this deal is:

An agreement consistent with this MOU would allow TSMC to build Atom-based SOCs (system-on-chip, which is a highly integrated piece of silicon that can do a multitude of tasks) for Intel customers using our Atom SOC cores combined with TSMC's existing intellectual property. The combination of these technologies would allow Intel to jumpstart its SOC business by filling some gaps in our technology portfolio that are necessary for adoption into the markets we are targeting. It is important to note that these designs would be for Intel customers and will be handled by Intel. Intel designers would design Atom SOC designs to TSMC process technology (specific details on that are not public) and couple those designs with TSMC-licensed technology. This agreement would not be specific for Netbooks or for handhelds but for all end market segments that would benefit from and demand the characteristics of an SOC (Embedded, CE, handhelds, Netbooks/Nettops). Intel believes that the performance and software compatibility of Atom-based SOC coupled with intellectual property elements necessary to offer a broad range of end products for our customers' needs would result in compelling solutions.

This is not a capacity outsource deal nor is this a process technology transfer. As stated above, Intel designers will port the Atom designs to a leading-edge TSMC process to allow Atom SOC cores to be coupled with added TSMC IP. This arrangement is also not an open license for TSMC to go out and market Atom-based devices on its own. All manufacturing in this arrangement is for Intel customers and with Intel products. Intel will control the terms of how and where these products will be sold and marketed.
What Intel gains from this deal:

Today, Intel does not possess some of the intellectual property that customers require for certain applications and market segments. Up until now, Intel's business model has been tuned to service the general-purpose computing market segment and not custom or semi-custom silicon applications. Over time, we expect to develop much of that capability, but porting such IP to the current Intel manufacturing flows will take time. This collaboration has the effect of jumpstarting our business opportunities by closing important technology gaps and broadening the Atom ecosystem. As you think about the progression of Moore's law--the fundamental driver of our business model--moving into system-on-chip products is a natural evolution where we can use our transistor budget to perform more and more functions on the same silicon as the CPU. This has the effect of lowering cost, improving performance, and reducing power consumption.

What TSMC gains from this agreement:
I don't want to speak for TSMC so I would encourage questions about TSMC specifically to go to them. The Intel response to this question is that TSMC would get to participate in the build-out of the Atom business, which we believe will be a substantial volume business over the next several years. Atom is already off to a very positive start, and as we continue to power-reduce this product and offer it in more integrated SOC solutions, the business opportunity will continue to expand. TSMC would have an opportunity to benefit from that expansion as TSMC helps build products around the ported Atom processor core.

aeondxf 发表于 2009-9-26 18:05
从来就没有过larrabee给台积电做这种说法

原来如此...

果然是很YY

台湾电子实力···牛哦···

TSMC真的很牛的话，怎么连本土的VIA都不会选它:D

SOI的TSMC怎么做？？搞笑

关于这些问题可以科普 往生记

Dr.BT 发表于 2009-9-29 09:48

VIA在台灣的ic設計公司裡............., 已經沒有太多影響力了吧
前寄予厚望的低公耗cpu, 實際上獲得pc/NB大廠採用的極少
原本預計主攻的山寨本市場, 也是全面潰敗......
VIA基本上目前拿不出像樣的拳頭產品, 在台灣ic設計公司中的實力
連前五都排不進去, 甚至可能前10都排不上

台积电代工的还是很不错的哦， 40nm制程，晶体管密度， 芯片规模都很强啊， 起码现在流片的NVIDIA和AMD的下代主力GPU，DIE的规模比INTEL那些要大得多啊， 尤其是NVIDIA那个下代GPU， 规模还是很变态的。

台积电45nm的良品率问题解决了吗？
当年那叫一个惨不忍睹啊，刚引进的时候据说只有20%，现在不知道怎么样了。