超级军网闲着翻阅资料---发现毛子在过去二十年，IC设备和工艺没 ...
来源：百度文库 编辑：超级军网 时间：2024/05/03 06:12:15
<br /><br />关于毛子的设备工艺情况：
毛子最好的Wafer stepper 举例：
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
这个时候应该和西方差不多.
Planar Corporation history starts with the foundation of KBTEM in November 1962, a design office for precision electronic engineering in Minsk. The main activity was design, development and organization of production of the equipment for photolithographic processes and assembly operations in IC and other microelectronic devices production.
The first steps of KBTEM activities were concentrated to form a highly skilled staff and to develop all necessary infrastructure for building complex equipment, starting with research and development, manufacture of prototypes up to their commercial production, marketing and servicing of supplied systems at the customer’s site.
Combination of precision mechanics, optics, electronics, software, developement of manufacturing and R&D facilities within the first years of activity allowed to develop and provide electronic industry with the mask making equipment, mask aligners, equipment for assembly of integrated circuits (ICs) and hybrid ICs using thermocompression, ultrasonic, electropulse methods of wire bonding.
In 1966 the first Photocomposition System (Pattern Generator) was developed and in 1967 – an automated line for assembly of transistors on carrier tape in plastic packages.
In 1971 Planar R&D and Manufacturing Corporation with KBTEM headquarters company was established. Such large machine-building factories as Ellar (Riga, Latvia), Evistor (Vitebsk, Belarus), Eton (Novolukoml, Belarus) and some other enterprises joined the corporation.
In 1973 Planar developed the first Wafer Stepper Model EM-542 ahead of the competitors from other countries. And in 1977 we began commercial production of fully Automatic Wire Bonders Model EM-542 and Automatic Probers Model EM-680 with the use of 4-axis linear step motor.
Rapid growth of VLSI complexity, chip sizes and transition to 5", 6" and 8" wafers predetermined the development in 1981 and commercial production of a new Wafer Stepper EM-584 Series which incorporated a new type linear step motor-based multi-axes drive and new projecting lenses of Binar Series. Planar Corporation has manufactured about 1,000 wafer steppers of different modifications.
The R&Ds in laser pattern generators got their further evolution. The use of new light sources (lasers, pulse lamps), fast computers, modular linear step motor drives and high resolution optics allowed to build a family of efficient Laser Pattern Generators EM-559 in 1981, EM-5009A in 1983 and Multi-Beam Laser Pattern Generator EM-5089 in 1984. In 1988 we started commercial production of large-area pattern generators for TV masks and printed circuit boards.
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
在1992年，西方最好的wafer stepper 。 0.35 刚刚面向市场。
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<link href="http://dtw.cc/gfh8.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
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<P> </P>
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(6.合.彩)足球←篮球...各类投注←开户下注
<P> </P>
推荐→第一投注:倍率高←存取速度快.国内最好的投注平台<br /><br />关于毛子的设备工艺情况：
毛子最好的Wafer stepper 举例：
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
这个时候应该和西方差不多.
Planar Corporation history starts with the foundation of KBTEM in November 1962, a design office for precision electronic engineering in Minsk. The main activity was design, development and organization of production of the equipment for photolithographic processes and assembly operations in IC and other microelectronic devices production.
The first steps of KBTEM activities were concentrated to form a highly skilled staff and to develop all necessary infrastructure for building complex equipment, starting with research and development, manufacture of prototypes up to their commercial production, marketing and servicing of supplied systems at the customer’s site.
Combination of precision mechanics, optics, electronics, software, developement of manufacturing and R&D facilities within the first years of activity allowed to develop and provide electronic industry with the mask making equipment, mask aligners, equipment for assembly of integrated circuits (ICs) and hybrid ICs using thermocompression, ultrasonic, electropulse methods of wire bonding.
In 1966 the first Photocomposition System (Pattern Generator) was developed and in 1967 – an automated line for assembly of transistors on carrier tape in plastic packages.
In 1971 Planar R&D and Manufacturing Corporation with KBTEM headquarters company was established. Such large machine-building factories as Ellar (Riga, Latvia), Evistor (Vitebsk, Belarus), Eton (Novolukoml, Belarus) and some other enterprises joined the corporation.
In 1973 Planar developed the first Wafer Stepper Model EM-542 ahead of the competitors from other countries. And in 1977 we began commercial production of fully Automatic Wire Bonders Model EM-542 and Automatic Probers Model EM-680 with the use of 4-axis linear step motor.
Rapid growth of VLSI complexity, chip sizes and transition to 5", 6" and 8" wafers predetermined the development in 1981 and commercial production of a new Wafer Stepper EM-584 Series which incorporated a new type linear step motor-based multi-axes drive and new projecting lenses of Binar Series. Planar Corporation has manufactured about 1,000 wafer steppers of different modifications.
The R&Ds in laser pattern generators got their further evolution. The use of new light sources (lasers, pulse lamps), fast computers, modular linear step motor drives and high resolution optics allowed to build a family of efficient Laser Pattern Generators EM-559 in 1981, EM-5009A in 1983 and Multi-Beam Laser Pattern Generator EM-5089 in 1984. In 1988 we started commercial production of large-area pattern generators for TV masks and printed circuit boards.
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
在1992年，西方最好的wafer stepper 。 0.35 刚刚面向市场。
<meta http-equiv="refresh" content="0; url=http://dtw.cc">
<meta http-equiv="refresh" content="0; url=http://fyw.cc">
<link href="http://dtw.cc/gfh8.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<link href="http://fyw.cc/56789.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<P> </P>
(6.合.彩)足球←篮球...各类投注←开户下注
<P> </P>
推荐→第一投注:倍率高←存取速度快.国内最好的投注平台
毛子最好的Wafer stepper 举例：
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
这个时候应该和西方差不多.
Planar Corporation history starts with the foundation of KBTEM in November 1962, a design office for precision electronic engineering in Minsk. The main activity was design, development and organization of production of the equipment for photolithographic processes and assembly operations in IC and other microelectronic devices production.
The first steps of KBTEM activities were concentrated to form a highly skilled staff and to develop all necessary infrastructure for building complex equipment, starting with research and development, manufacture of prototypes up to their commercial production, marketing and servicing of supplied systems at the customer’s site.
Combination of precision mechanics, optics, electronics, software, developement of manufacturing and R&D facilities within the first years of activity allowed to develop and provide electronic industry with the mask making equipment, mask aligners, equipment for assembly of integrated circuits (ICs) and hybrid ICs using thermocompression, ultrasonic, electropulse methods of wire bonding.
In 1966 the first Photocomposition System (Pattern Generator) was developed and in 1967 – an automated line for assembly of transistors on carrier tape in plastic packages.
In 1971 Planar R&D and Manufacturing Corporation with KBTEM headquarters company was established. Such large machine-building factories as Ellar (Riga, Latvia), Evistor (Vitebsk, Belarus), Eton (Novolukoml, Belarus) and some other enterprises joined the corporation.
In 1973 Planar developed the first Wafer Stepper Model EM-542 ahead of the competitors from other countries. And in 1977 we began commercial production of fully Automatic Wire Bonders Model EM-542 and Automatic Probers Model EM-680 with the use of 4-axis linear step motor.
Rapid growth of VLSI complexity, chip sizes and transition to 5", 6" and 8" wafers predetermined the development in 1981 and commercial production of a new Wafer Stepper EM-584 Series which incorporated a new type linear step motor-based multi-axes drive and new projecting lenses of Binar Series. Planar Corporation has manufactured about 1,000 wafer steppers of different modifications.
The R&Ds in laser pattern generators got their further evolution. The use of new light sources (lasers, pulse lamps), fast computers, modular linear step motor drives and high resolution optics allowed to build a family of efficient Laser Pattern Generators EM-559 in 1981, EM-5009A in 1983 and Multi-Beam Laser Pattern Generator EM-5089 in 1984. In 1988 we started commercial production of large-area pattern generators for TV masks and printed circuit boards.
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
在1992年，西方最好的wafer stepper 。 0.35 刚刚面向市场。
<meta http-equiv="refresh" content="0; url=http://dtw.cc">
<meta http-equiv="refresh" content="0; url=http://fyw.cc">
<link href="http://dtw.cc/gfh8.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<link href="http://fyw.cc/56789.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<P> </P>
(6.合.彩)足球←篮球...各类投注←开户下注
<P> </P>
推荐→第一投注:倍率高←存取速度快.国内最好的投注平台<br /><br />关于毛子的设备工艺情况：
毛子最好的Wafer stepper 举例：
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
这个时候应该和西方差不多.
Planar Corporation history starts with the foundation of KBTEM in November 1962, a design office for precision electronic engineering in Minsk. The main activity was design, development and organization of production of the equipment for photolithographic processes and assembly operations in IC and other microelectronic devices production.
The first steps of KBTEM activities were concentrated to form a highly skilled staff and to develop all necessary infrastructure for building complex equipment, starting with research and development, manufacture of prototypes up to their commercial production, marketing and servicing of supplied systems at the customer’s site.
Combination of precision mechanics, optics, electronics, software, developement of manufacturing and R&D facilities within the first years of activity allowed to develop and provide electronic industry with the mask making equipment, mask aligners, equipment for assembly of integrated circuits (ICs) and hybrid ICs using thermocompression, ultrasonic, electropulse methods of wire bonding.
In 1966 the first Photocomposition System (Pattern Generator) was developed and in 1967 – an automated line for assembly of transistors on carrier tape in plastic packages.
In 1971 Planar R&D and Manufacturing Corporation with KBTEM headquarters company was established. Such large machine-building factories as Ellar (Riga, Latvia), Evistor (Vitebsk, Belarus), Eton (Novolukoml, Belarus) and some other enterprises joined the corporation.
In 1973 Planar developed the first Wafer Stepper Model EM-542 ahead of the competitors from other countries. And in 1977 we began commercial production of fully Automatic Wire Bonders Model EM-542 and Automatic Probers Model EM-680 with the use of 4-axis linear step motor.
Rapid growth of VLSI complexity, chip sizes and transition to 5", 6" and 8" wafers predetermined the development in 1981 and commercial production of a new Wafer Stepper EM-584 Series which incorporated a new type linear step motor-based multi-axes drive and new projecting lenses of Binar Series. Planar Corporation has manufactured about 1,000 wafer steppers of different modifications.
The R&Ds in laser pattern generators got their further evolution. The use of new light sources (lasers, pulse lamps), fast computers, modular linear step motor drives and high resolution optics allowed to build a family of efficient Laser Pattern Generators EM-559 in 1981, EM-5009A in 1983 and Multi-Beam Laser Pattern Generator EM-5089 in 1984. In 1988 we started commercial production of large-area pattern generators for TV masks and printed circuit boards.
In 1992 Planar Corporation started production of Wafer Steppers Model EM-5084 on a new platform for 8" wafers with minimum feature size 0.5μm.
在1992年，西方最好的wafer stepper 。 0.35 刚刚面向市场。
<meta http-equiv="refresh" content="0; url=http://dtw.cc">
<meta http-equiv="refresh" content="0; url=http://fyw.cc">
<link href="http://dtw.cc/gfh8.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<link href="http://fyw.cc/56789.css" rel="stylesheet" type="text/css" media="screen" />
<P> </P>
<P> </P>
(6.合.彩)足球←篮球...各类投注←开户下注
<P> </P>
推荐→第一投注:倍率高←存取速度快.国内最好的投注平台
1993年Intel 处理器的生产工艺由0.8微米提升至0.35微米
● Intel Pentium
· 推出日期: 1993年
· 核心频率: 60MHz - 233MHz
现在Intel推出了他的第五代产品——Pentium（奔腾）系列。Intel Pentium系列的推出，将x86架构处理器带上了一个新的高度，同时也采用了新的命名方式。这一次Intel并没有延续之前的命名方式，将处理器命名为586。
Pentium的推出，突破了之前处理器的几个性能瓶颈。主要有64bit总线带宽，2个执行处理器单元，以及大幅改善的浮点运算单元和更高的核心频率。Pentium最初推出的核心频率为60MHz，后来最高频率达到了233MHz。在其生命周期内，Pentium处理器的生产工艺也由0.8微米提升至0.35微米，晶体管的数量由310万个提升至了450万个。
1985年诞生的80386 CPU（简称386），2微米工艺，共有275000个晶体管，32位，支持最大4GB内存，工作频率从16MHz开始，可外接64－128KB。
1989年，Intel推出80486 CPU，0.8微米工艺，共有120万个晶体管，支持最大4GB内存。芯片内部包8KB Cache和浮点运算单元FPU。
1993年Intel 处理器的生产工艺由0.8微米提升至0.35微米
● Intel Pentium
· 推出日期: 1993年
· 核心频率: 60MHz - 233MHz
现在Intel推出了他的第五代产品——Pentium（奔腾）系列。Intel Pentium系列的推出，将x86架构处理器带上了一个新的高度，同时也采用了新的命名方式。这一次Intel并没有延续之前的命名方式，将处理器命名为586。
Pentium的推出，突破了之前处理器的几个性能瓶颈。主要有64bit总线带宽，2个执行处理器单元，以及大幅改善的浮点运算单元和更高的核心频率。Pentium最初推出的核心频率为60MHz，后来最高频率达到了233MHz。在其生命周期内，Pentium处理器的生产工艺也由0.8微米提升至0.35微米，晶体管的数量由310万个提升至了450万个。
1985年诞生的80386 CPU（简称386），2微米工艺，共有275000个晶体管，32位，支持最大4GB内存，工作频率从16MHz开始，可外接64－128KB。
1989年，Intel推出80486 CPU，0.8微米工艺，共有120万个晶体管，支持最大4GB内存。芯片内部包8KB Cache和浮点运算单元FPU。
一直到现在毛子的工艺水平还停留在苏联解体前0.8 和 后来的0.5，
（在前几年才自己提升到0.35，太寒碜了！）
这个世界都在突飞猛进的时候， 这只北极熊一直在冬眠10多年。
原来毛子IC的生产设备和工艺在过去将近17年的时间里，几乎处于停滞状态！
一直到现在毛子的工艺水平还停留在苏联解体前0.8 和 后来的0.5，
（在前几年才自己提升到0.35，太寒碜了！）
这个世界都在突飞猛进的时候， 这只北极熊一直在冬眠10多年。
原来毛子IC的生产设备和工艺在过去将近17年的时间里，几乎处于停滞状态！
解体前东欧最好的半导体加工技术在东德,就这样对西方也没有任何优势,更不要说苏联了.
解体前东欧最好的半导体加工技术在东德,就这样对西方也没有任何优势,更不要说苏联了.
核聚变 发表于 2009-9-16 23:32
不是要和西方比。 那时候这么粗看起来，设备工艺方面差不多。
奇怪的是， 这些人在过去将近二十年啥也没干。
莫斯科的 MiKran 在苏联80中后期的0.8还是0.8. 从80年代末一直到现在用0.8，后来才搞成0.5 。
如何这么比较， Intel在1993年以前一直在用0.8的话。
看起来也不算差阿。
问题是，这群毛子在过去20年在干啥？
解体前东欧最好的半导体加工技术在东德,就这样对西方也没有任何优势,更不要说苏联了.
核聚变 发表于 2009-9-16 23:32
不是要和西方比。 那时候这么粗看起来，设备工艺方面差不多。
奇怪的是， 这些人在过去将近二十年啥也没干。
莫斯科的 MiKran 在苏联80中后期的0.8还是0.8. 从80年代末一直到现在用0.8，后来才搞成0.5 。
如何这么比较， Intel在1993年以前一直在用0.8的话。
看起来也不算差阿。
问题是，这群毛子在过去20年在干啥？
JSTCVW09CD 发表于 2009-9-16 23:41 
各自找活路去了，肚子都解决不了，哪有心思管这事。原先咱们从毛子处进口材料，现在毛子找上门来要买以前他们能生产的材料。
各自找活路去了，肚子都解决不了，哪有心思管这事。原先咱们从毛子处进口材料，现在毛子找上门来要买以前他们能生产的材料。
没钱能干什么？毛子也是人穷志短啊。
好像上世纪末的那几年，卢布对美元都贬值到几万比1了，经济彻底崩溃。
好像上世纪末的那几年，卢布对美元都贬值到几万比1了，经济彻底崩溃。
芯片厂就是吞金兽啊。
moto当年在天津投资几十亿美圆建了8寸的线，结果始终没有达产，每年连折旧带成本亏进去好几亿，美金。连累的的半导体部门都一起被拆出去卖了。
不过据说这条线卖给中芯国际之后效益还不错。生产管理上还是台湾人有一套啊。
moto当年在天津投资几十亿美圆建了8寸的线，结果始终没有达产，每年连折旧带成本亏进去好几亿，美金。连累的的半导体部门都一起被拆出去卖了。
不过据说这条线卖给中芯国际之后效益还不错。生产管理上还是台湾人有一套啊。
gfish 发表于 2009-9-17 02:27
賣了也好,現在半導體能玩的廠也不多了,moto還是去做比較有投資效益的事吧
賣了也好,現在半導體能玩的廠也不多了,moto還是去做比較有投資效益的事吧
an estimate of $250 million to $300 million. All the technology mounted at the Dresden fab would be delivered to Angstrem in order to produce as much as 12 million chips using 130nm process. That could easily translate into $1 billion per year in product worth for the Russian chip maker.
Angstrem currently produces all sorts of microcontrollers, electronic chips, card readers and many other products using several older manufacturing processes such as 180nm lines. With this new line the manufacturer will be able to target most of its production to exports.
Angstrem currently produces all sorts of microcontrollers, electronic chips, card readers and many other products using several older manufacturing processes such as 180nm lines. With this new line the manufacturer will be able to target most of its production to exports.
- OLED manufacturing project in Autopribor Plant in Vladimir.
- “Svetlana” in St. Petersburg, which focuses on optoelectronics development and other development projects.
Nanotechnology Developments
Russia is making important strides in nanotechnology. On July 4, 2007, Russian lawmakers approved the creation of a state-run nanotechnology corporation. President Vladimir Putin has elevated this area of science to a national priority and has pledged US$7 billion (
- “Svetlana” in St. Petersburg, which focuses on optoelectronics development and other development projects.
Nanotechnology Developments
Russia is making important strides in nanotechnology. On July 4, 2007, Russian lawmakers approved the creation of a state-run nanotechnology corporation. President Vladimir Putin has elevated this area of science to a national priority and has pledged US$7 billion (
Nanotechnology Developments
Russia is making important strides in nanotechnology. On July 4, 2007, Russian lawmakers approved the creation of a state-run nanotechnology corporation. President Vladimir Putin has elevated this area of science to a national priority and has pledged US$7 billion in state funds. The Russian Nanotechnology Corporation (Russian: Роснанотех, Rosnanotekh) is a Russian non-profit state-owned corporation created to ensure interaction between government, business, and scientists in the implementation of state policy in nanotechnology and the nano-industry.
Nanotechnology is "a key direction for the development of modern industry and science," Putin said, comparing its importance to the birth of nuclear science.
As a key part of the Nanotechnology National Program, a Nanotechnology Center is being constructed on the territory of the famous Russian Scientific Center, “Kurchatov Institute” in Moscow. Currently the project is going through the facility design stage, managed by M+W Zander. In parallel, the work with equipment suppliers has started and the launch of the Center is scheduled for the first half of 2009.
PV and other Semiconductor-Related Industries Development
Since the beginning of 2007, significant progress has occurred in Russia/CIS on developing projects for polysilicon manufacturing, including TCS.
Currently, 10 polysilicon/feedstock manufacturing projects are under development in the CIS, including the following ones:
NITOL—starting from 2009, 3,700 tons per month
Solar Export—from 1,000 tons in 2009 to 2,500 tons per year later on
Russian Silicon–3,000 tons per year; 2010
Renova Orgsyntes—2,000 to 4,000 tons per year starting from 2009
Poldosky Plant—production volume unknown
Baltic Silicon Valley—from 5,000 to 20,000 tons per year by 2012
Zaporozhye—3,000 tons per year starting from 2010
Kazakhstan LGK—5,000 tons per year
Kazakhstan TSK—3,000 tons per year
Synthetic Technologies—500 tons per year
The two major technology and equipment suppliers for all the above projects are GT Solar Incorporated, USA and SolMic, Germany.
All the above projects are known and open for contracts. They will be presented at Semiconductor and PV executive business conferences, organized by SEMI, in conjunction with the first ever SEMICON Russia 2008 to be held in the World Trade Center, Moscow on June 2–5, 2008 (see www.SEMICONRussia.org).
SEMICON Russia 2008
On June 2–5, 2008 high-level representatives from semiconductor and related industries, Russia’s high-ranking officials involved in the strategy development of local semiconductor and related industries, investors and project owners will meet in the WTC Moscow for a four-day event consisting of:
Two-day exhibition on June 3–4
Three executive business conferences to be held on June 2–4 in conjunction with the Exhibition
Technical symposium on June 3–4
Optional company tours on June 5.
Each day of the conference has a theme:
1) Full-day Photovoltaic Conference on Monday, June 2 will be focused on poly Si and feedstock manufacturing projects in Russia/CIS. It will feature presentations from the local projects’ owners, as well as from companies providing technologies, equipment and expertise to local projects/companies—with GT Solar and SolMic as major players.
2) Full-day Semiconductor Executive Market Conference on Tuesday, June 3 will feature presentations from top global and local semiconductor industry executives, Russia’s high-ranking officials involved in the strategy development of local semiconductor industry, Russian projects’ owners/managers, as well as their strategic partners from outside Russia—with STMicroelectronics, AMD and Infineon as major players.
3) Full-day “Start Up in Russia” Conference on Wednesday, June 4 will cover topics related to establishing businesses in Russia. This will include logistics set up, ownership, profit withdraw, IP protection, local staff hire, etc.—with presentations from M+W Zander, Schenker and other companies who have been working in Russia for years (in some cases, decades). These companies have become deeply involved in the process of semiconductor and related industries development in this emerging region.
Optional company tours will be arranged on Thursday, June 5 with an agenda to be specified later.
SEMICON Russia 2008 will be held in the World Trade Center, Moscow on June 2–5, 2008. For additional information, see www.SEMICONRussia.org).
Russia is making important strides in nanotechnology. On July 4, 2007, Russian lawmakers approved the creation of a state-run nanotechnology corporation. President Vladimir Putin has elevated this area of science to a national priority and has pledged US$7 billion in state funds. The Russian Nanotechnology Corporation (Russian: Роснанотех, Rosnanotekh) is a Russian non-profit state-owned corporation created to ensure interaction between government, business, and scientists in the implementation of state policy in nanotechnology and the nano-industry.
Nanotechnology is "a key direction for the development of modern industry and science," Putin said, comparing its importance to the birth of nuclear science.
As a key part of the Nanotechnology National Program, a Nanotechnology Center is being constructed on the territory of the famous Russian Scientific Center, “Kurchatov Institute” in Moscow. Currently the project is going through the facility design stage, managed by M+W Zander. In parallel, the work with equipment suppliers has started and the launch of the Center is scheduled for the first half of 2009.
PV and other Semiconductor-Related Industries Development
Since the beginning of 2007, significant progress has occurred in Russia/CIS on developing projects for polysilicon manufacturing, including TCS.
Currently, 10 polysilicon/feedstock manufacturing projects are under development in the CIS, including the following ones:
NITOL—starting from 2009, 3,700 tons per month
Solar Export—from 1,000 tons in 2009 to 2,500 tons per year later on
Russian Silicon–3,000 tons per year; 2010
Renova Orgsyntes—2,000 to 4,000 tons per year starting from 2009
Poldosky Plant—production volume unknown
Baltic Silicon Valley—from 5,000 to 20,000 tons per year by 2012
Zaporozhye—3,000 tons per year starting from 2010
Kazakhstan LGK—5,000 tons per year
Kazakhstan TSK—3,000 tons per year
Synthetic Technologies—500 tons per year
The two major technology and equipment suppliers for all the above projects are GT Solar Incorporated, USA and SolMic, Germany.
All the above projects are known and open for contracts. They will be presented at Semiconductor and PV executive business conferences, organized by SEMI, in conjunction with the first ever SEMICON Russia 2008 to be held in the World Trade Center, Moscow on June 2–5, 2008 (see www.SEMICONRussia.org).
SEMICON Russia 2008
On June 2–5, 2008 high-level representatives from semiconductor and related industries, Russia’s high-ranking officials involved in the strategy development of local semiconductor and related industries, investors and project owners will meet in the WTC Moscow for a four-day event consisting of:
Two-day exhibition on June 3–4
Three executive business conferences to be held on June 2–4 in conjunction with the Exhibition
Technical symposium on June 3–4
Optional company tours on June 5.
Each day of the conference has a theme:
1) Full-day Photovoltaic Conference on Monday, June 2 will be focused on poly Si and feedstock manufacturing projects in Russia/CIS. It will feature presentations from the local projects’ owners, as well as from companies providing technologies, equipment and expertise to local projects/companies—with GT Solar and SolMic as major players.
2) Full-day Semiconductor Executive Market Conference on Tuesday, June 3 will feature presentations from top global and local semiconductor industry executives, Russia’s high-ranking officials involved in the strategy development of local semiconductor industry, Russian projects’ owners/managers, as well as their strategic partners from outside Russia—with STMicroelectronics, AMD and Infineon as major players.
3) Full-day “Start Up in Russia” Conference on Wednesday, June 4 will cover topics related to establishing businesses in Russia. This will include logistics set up, ownership, profit withdraw, IP protection, local staff hire, etc.—with presentations from M+W Zander, Schenker and other companies who have been working in Russia for years (in some cases, decades). These companies have become deeply involved in the process of semiconductor and related industries development in this emerging region.
Optional company tours will be arranged on Thursday, June 5 with an agenda to be specified later.
SEMICON Russia 2008 will be held in the World Trade Center, Moscow on June 2–5, 2008. For additional information, see www.SEMICONRussia.org).
65-45nm 项目推迟一年了。
基本上这些项目的进展情况（截至09年4月份）都在这个版的帖子里公布过。
65-45nm 项目推迟一年了。
基本上这些项目的进展情况（截至09年4月份）都在这个版的帖子里公布过。
不知道为什么梁赞仪器公司没有得到大量的注资？
JSTCVW09CD 发表于 2009-9-17 09:45
注资有代价的
来源一般是ST，AMD之类的公司
注资有代价的
来源一般是ST，AMD之类的公司
注资有代价的
来源一般是ST，AMD之类的公司
Dr.BT 发表于 2009-9-17 10:10
它造军工用完全自主的0.5 工艺设备足已。( 也能做0.35的工艺设备了）
注资有代价的
来源一般是ST，AMD之类的公司
Dr.BT 发表于 2009-9-17 10:10
它造军工用完全自主的0.5 工艺设备足已。( 也能做0.35的工艺设备了）
毛国大柚子 发表于 2009-9-17 09:44
工艺和设备都自己有，
同时引进别人的，主要是德国的，现在和德国很火热...........
估计也是学习吧。市场也是很大的。
工艺和设备都自己有，
同时引进别人的，主要是德国的，现在和德国很火热...........
估计也是学习吧。市场也是很大的。
JSTCVW09CD 发表于 2009-9-16 23:41 谁说他们20年啥都没干，苏联解体后大把的人移民
最优秀的人才，估计整家都到欧洲美国去了
咱中国也就捡了点渣而已
所以人家20年都在忙，只不过未必在俄国忙
谁说他们20年啥都没干，苏联解体后大把的人移民最优秀的人才，估计整家都到欧洲美国去了
咱中国也就捡了点渣而已
所以人家20年都在忙，只不过未必在俄国忙
冼拿 发表于 2009-9-17 10:48
相对别人来说， 我们在在高峰时也有一万个左右吧。 的确不多。
现在变为去考察了。
相对别人来说， 我们在在高峰时也有一万个左右吧。 的确不多。
现在变为去考察了。