看X86 SOC发展,在超大IT论坛发文一篇

首先看intel平台,从2008Q2开始推面对消费品市场的PM核心CE3100,面对MID市场的ATOM以来,SOC产品计划2009Q4上市
再看AMD,由于服务器/桌面市场压力,造成SOC产品一直推迟,得2010Q2以后才能出来
NV方面由于没有X86,因此搞了一个ARM平台练手,未来最好的选择是入主VIA,将嵌入/工控部分留给VIA原有部门,依托VIA的CPU部门结果自己的消费品部门开发一款低功耗的SOC,
VIA方面虽然比INTEL产品早将近2年,但限于营销能力,一直没有大的发展(主要由于是定位于嵌入市场),不过如果能用EDGE加新出的VX855芯片组,应该可以达成4W以内的平台

VIA VX855 Media System Processor Brings Power-Efficiency to 1080p HD Video Playback                    VIAVX855 MSP offers hardware H.264 video acceleration in a tiny, highlyintegrated single chip package with an ultra low TDP of 2.3 watts

VIA VX855 Media System Processor: Bringing 1080p HD Video to Power Efficient SFF and Mobile Devices                                                                                                                                                                                                                                           TheVIA VX855 Media System Processor (MSP) is a power efficient, highlyintegrated all-in-one chipset that addresses the key requirements oftoday’s small form factor and mobile PC systems.                                             Forthe first time, the VIA VX855 MSP offers full hardware acceleration ofthe widest variety of leading video standards including H.264,MPEG-2/4, DivX and WMV9, allowing smooth playback of high bit-rate1080p HD video. The advanced video decoding capabilities, when coupledwith the media system processor's small physical size and a thermaldesign power (TDP) of a mere 2.3 watts, open up exciting opportunitiesfor power efficient small form factor and mobile devices; especiallythe mini-notebook PC segment that will now be able to offer true 1080pHD video playback.                                             Additionally,support for all leading operating systems including the forthcomingMicrosoft® Windows 7 OS offers flexibility and greater applicability toa wide spectrum of established, growing and new x86 market segments.                                           TheVIA VX855 MSP integrates all the cutting-edge features of a modernchipset's North and South bridges into a 27mm x 27mm single chippackage that saves over 46% of silicon real estate compared withcompeting twin-chip core logic implementations. This miniaturization,combined with extensive power management technologies and the VIAVX855’s ability to run fanlessly, enables system builders to designever smaller, lighter, and more portable systems.

Key Features of the VIA VX855 MSP                                                                                         High Performance 2D/3D Graphics:The VIA Chrome9™ HCM 3D integrated graphics core boasts full DirectX9.0 support and a 128-bit 2D engine with hardware rotation capability Powerful Video Decoding  Technology:The VIA Chromotion™ video engine delivers a Hi-Def™ visual experience,including advanced video acceleration for  H.264, MPEG-2, MPEG-4, WMV9,and DivX video formats, plus a VMR-capable HD video processor Advanced HD Audio:The built-in VIA Vinyl HD Audio controller supports up to eight highdefinition channels with a 192kHz sampling rate, delivering a richerall-round digital media experience Intuitive Memory Technology: VIA's renowned memory controller technology supports up to two low-power,  high-bandwidth DDR2 memory modules Display Flexibility:Anintegrated multi-configuration, single-channel LVDS transmitter enablesdisplay connection to embedded panels, as well as CRT and CMOS LCDmonitors Consumer  Electronics Interfaces: Supports the low  power device interfaces of SDIO, UART and SPI, as well as up to six USB 2.0  ports.

Block                                                                                                         Diagram

Key Specifications of the VIA VX855 MSP                                                                                                                                                                                    Supported  Processors                                                VIA Nano™ / C7® / Eden™ processor 400 - 800MHz FSB speed                                               Memory  Controller                                                Up to DDR2 800 Supports up to two 64-bit DDR2 DIMM slots (4 GB max) Supports 16-bit dedicated display frame buffer (optional)                                               Storage  Interface Support                                               UDMA IDE Support SD/MS/MMC/XD                                               Peripheral  Interface                                              Six USB2.0 ports One USB2.0 device port Supports LPC bus Supports SDIO, SPI and UART                                               Integrated  2D/3D/Video Processor                                              VIA Chrome9 HCM DX9 3D engine 128-bit 2D engine with hardware rotation capability High Definition video processor with VMR capability Up to 512 MB frame buffer                                               Display  Interface                                                Three 10-bit 350 MHz RAMDACs Single - channel LVDS 18-bit TTL                                               Unified  Video Decoding Processor                                                MPEG-2/H.264 VLD hardware decoding acceleration MPEG-4, VC1 and DivX video decoding acceleration                                               High  Definition Audio Interface                                                Supports up to 32-bit sample depth at 192 kHz sampling       rate Supports three codecs and eight streams Supports HD modem                                               Video Capture   Port                                              One 16-bit input or One 8-bit TS input + one Serial TS input or CCIR656/601 input + one Serial TS input                                               Supported  Software Standards                                               Microsoft® DirectX 9.0, Microsoft® Windows XP and Vista,       Win CE and Linux                                               Power  Management                                                ACPI 3.0 and PCI Bus Power Management 1.1 compliant Snapshot extensive system power management                                               Package                                                Flip-Chip Ball Grid Array (FCBGA) Package Size: 27 x 27mm/0.8mm                                               Core  Voltage                                               1.2V

VIA Eden® Processors - Low Power Fanless Processing                         With its signature fanless operation, the VIA Eden™ processor familytargets personal, business, industrial and commercial embeddedcomputing devices that require ultra low power consumption, rock solidreliability and compatibility with standard x86 operating systems andsoftware applications. VIA Eden processors are scalable from 400MHz to1.5GHz all within a maximum thermal envelope of 7.5 watts, and areavailable with a diverse range of feature sets that enable PCfunctionality and connectivity from traditionally single functiondevices.                          The VIA Eden processor familyis available in nanoBGA, nanoBGA2 and EBGA packaging, using 150nm,130nm and the latest 90nm SOI manufacturing process to deliver leadingperformance per watt and in fully RoHS compliant packages.

Available Models                        Please click on the processor name for more information on each processor:                                                      Process Technology Processor Name Core Architecture Clock Speed Range FSB Package/ Size 90nm   VIA Eden 'Esther' 400MHz-1.2GHz 400MHz NanoBGA2 21mmx21mm 90nm   VIA Eden ULV 'Esther' 1.0GHz, 1.5GHz 400MHz NanoBGA2 21mmx21mm 0.13um   VIA Eden-N 'Nehemiah' 533MHz-1.0GHz 133MHz NanoBGA 15mmx15mm 0.13um   VIA Eden ESP 'Nehemiah' 667MHz-1.0GHz 133MHz EBGA 35mmx35mm 0.15um   VIA Eden ESP 'Samuel 2' 300MHz-600MHz 66/ 100/ 133MHz EBGA 35mmx35mm                         Pleasecontact your local VIA sales representative for information regardingavailability of VIA Eden processors, or send an email to VIA at mkt@via.com.tw

VIA Eden Processor Applications                        Thelow power consumption, excellent heat dissipation and leading powerefficiency makes the VIA Eden processor ideal for a wide range ofcompact, quiet devices for the home, office, car, shops, hospitals,public institutions, industrial plants and much, much more; below arejust some of the key applications in which the VIA Eden processor hasalready gained market momentum:

Secure by Design                        VIA Eden processors are helping to herald an era of practical pervasive security thanks to the VIA PadLock Security Engine,the world's fastest x86 security engine in the world featuring the mostcomprehensive suite of tools for key cryptographic operations.                                                  Over the last couple of processor core generations, VIA has expandedthe hardware security suite integrated directly onto the processor die,starting with the world's best random number generator (RNG) and AESEncryption Engine in the C5P (Nehemiah) processor core to SHA-1 andSHA-256 hashing for secure message digests, and a hardware basedMontgomery Multiplier supporting key sizes up to 32K in length toaccelerate public key cryptography, such as RSA™ in the latest C5J(Esther) core. This latest generation also provides NX ExecuteProtection, providing protection from malicious software such as wormsand viruses, and is used in Microsoft® Windows® XP with SP2.Integrating security directly onto the processor die ensures speeds andefficiency many times that available in software, yet with negligibleimpact on processor performance.                          Learn more...                          VIA Eden Processors: Security Feature Comparison VIA Eden 0.13, 0.15µm VIA Eden 90nm Benefits Secure Hash Full SHA-1 & SHA-256 20Gbps peak                                     World's fastest x86 Secure Hash engine                                    Data integrity and origin authentication in data transfer Virus Protection NX Bit Protects against worm attacks and propagation Encryption Full AES Encryption ECB, CBC, CFB, OFB hardware modes 25Gbps peak@2GHz +RSA hardware assist (Montgomery Multiplier)                                     World's fastest x86 encryption                                    Miltary-grade                                    Data encryption acceleration for RSA Public Key Security Hardware RNG 2 hardware RGNs + enchanced performance             + feeds to SHA                                     World's fastest x86 Quantum RNG                                    Superior to software based generation                                    World's heighest level of x86 based entropy

Moorestown平台，搭配全新的Lincroft处理器，芯片组则Langwell，Lincroft处理器集成了内存控制器和图形核心。

The Moorestown Update: Atom in Smartphones

The successor to Menlow is Moorestown. Also built on a 45nm process, Moorestown is a highly integrated version of Menlow composed of the following components:

    1) Lincroft System on a Chip (SoC)
    2) Langwell South Hub
    3) PMIC
    4) Evans Peak Networking

Moorestown is composed of two chips: a north hub and a south hub. The Lincroft SoC is the north hub and it features a LPIA (Low Power Intel Architecture) CPU core (Silverthorne derivative), on-die graphics and on-die memory controller. Both video encode and decode hardware are also included on-die. This is a big step from Menlow because the GPU is now built on a 45nm process since it’s contained on the CPU die itself. The on-die memory controller should also help performance of the in-order core which is highly dependent on receiving dependent data as quickly as possible.

The Langwell south hub is an extremely focused piece of silicon given how highly integrated the Lincroft north hub/CPU is. Langwell is composed of a system controller, solid state disk controller and I/O blocks for things like USB or audio.

The Power Management IC (PMIC) plays a mystery role at this point. Intel is just revealing that it handles power management for the platform yet not fully detailing its active roles. The PMIC interfaces with the Langwell south hub which is being licensed to 3rd parties to actually make the PMIC.

The final component of Moorestown is the Evans Peak networking hub, which is made up of Intel and non-Intel silicon. Intel will enable Wi-Fi, WiMAX, Bluetooth and GPS while 3rd party vendors can supply chips to enable things like 3G on Moorestown platforms.

As we mentioned before, Moorestown rids the platform of any PCI bus which apparently precludes it from being used with Windows Vista, because of this all Moorestown based MIDs will be running Linux. Linux is a far better fit for something like Menlow or Moorestown simply because the performance levels are too low to be used with a hog like Vista. Vista can work on these platforms, just not with iPhone-smoothness.

Thanks to the integration made possible with Moorestown idle power will be reduced by a factor of 10x over Menlow. With such a low idle power, voice applications now become possible with Moorestown.

Moorestown will allow Intel’s Atom CPU to exist in larger smart phones (4 - 5” size), while its successor in 2010/2011 will use the magic of Intel’s 32nm process to finally get into something iPhone-sized.首先看intel平台,从2008Q2开始推面对消费品市场的PM核心CE3100,面对MID市场的ATOM以来,SOC产品计划2009Q4上市
再看AMD,由于服务器/桌面市场压力,造成SOC产品一直推迟,得2010Q2以后才能出来
NV方面由于没有X86,因此搞了一个ARM平台练手,未来最好的选择是入主VIA,将嵌入/工控部分留给VIA原有部门,依托VIA的CPU部门结果自己的消费品部门开发一款低功耗的SOC,
VIA方面虽然比INTEL产品早将近2年,但限于营销能力,一直没有大的发展(主要由于是定位于嵌入市场),不过如果能用EDGE加新出的VX855芯片组,应该可以达成4W以内的平台

VIA VX855 Media System Processor Brings Power-Efficiency to 1080p HD Video Playback                    VIAVX855 MSP offers hardware H.264 video acceleration in a tiny, highlyintegrated single chip package with an ultra low TDP of 2.3 watts

VIA VX855 Media System Processor: Bringing 1080p HD Video to Power Efficient SFF and Mobile Devices                                                                                                                                                                                                                                          TheVIA VX855 Media System Processor (MSP) is a power efficient, highlyintegrated all-in-one chipset that addresses the key requirements oftoday’s small form factor and mobile PC systems.
                                            Forthe first time, the VIA VX855 MSP offers full hardware acceleration ofthe widest variety of leading video standards including H.264,MPEG-2/4, DivX and WMV9, allowing smooth playback of high bit-rate1080p HD video. The advanced video decoding capabilities, when coupledwith the media system processor's small physical size and a thermaldesign power (TDP) of a mere 2.3 watts, open up exciting opportunitiesfor power efficient small form factor and mobile devices; especiallythe mini-notebook PC segment that will now be able to offer true 1080pHD video playback.
                                            Additionally,support for all leading operating systems including the forthcomingMicrosoft® Windows 7 OS offers flexibility and greater applicability toa wide spectrum of established, growing and new x86 market segments.
                                          TheVIA VX855 MSP integrates all the cutting-edge features of a modernchipset's North and South bridges into a 27mm x 27mm single chippackage that saves over 46% of silicon real estate compared withcompeting twin-chip core logic implementations. This miniaturization,combined with extensive power management technologies and the VIAVX855’s ability to run fanlessly, enables system builders to designever smaller, lighter, and more portable systems.
                                          Key Features of the VIA VX855 MSP                                          

•                                               High Performance 2D/3D Graphics:The VIA Chrome9™ HCM 3D integrated graphics core boasts full DirectX9.0 support and a 128-bit 2D engine with hardware rotation capability
• Powerful Video Decoding  Technology:The VIA Chromotion™ video engine delivers a Hi-Def™ visual experience,including advanced video acceleration for  H.264, MPEG-2, MPEG-4, WMV9,and DivX video formats, plus a VMR-capable HD video processor
• Advanced HD Audio:The built-in VIA Vinyl HD Audio controller supports up to eight highdefinition channels with a 192kHz sampling rate, delivering a richerall-round digital media experience
• Intuitive Memory Technology: VIA's renowned memory controller technology supports up to two low-power,  high-bandwidth DDR2 memory modules
• Display Flexibility:Anintegrated multi-configuration, single-channel LVDS transmitter enablesdisplay connection to embedded panels, as well as CRT and CMOS LCDmonitors
• Consumer  Electronics Interfaces: Supports the low  power device interfaces of SDIO, UART and SPI, as well as up to six USB 2.0  ports.

                                                                          Block                                                                                                         Diagram                                                                              Key Specifications of the VIA VX855 MSP                                                                                                                                                                                    Supported  Processors                                               

• VIA Nano™ / C7® / Eden™ processor
• 400 - 800MHz FSB speed

                                              Memory  Controller                                               

• Up to DDR2 800
• Supports up to two 64-bit DDR2 DIMM slots (4 GB max)
• Supports 16-bit dedicated display frame buffer (optional)

                                              Storage  Interface Support                                              

• UDMA IDE
• Support SD/MS/MMC/XD

                                              Peripheral  Interface                                             

• Six USB2.0 ports
• One USB2.0 device port
• Supports LPC bus
• Supports SDIO, SPI and UART

                                              Integrated  2D/3D/Video Processor                                             

• VIA Chrome9 HCM DX9 3D engine
• 128-bit 2D engine with hardware rotation capability
• High Definition video processor with VMR capability
• Up to 512 MB frame buffer

                                              Display  Interface                                               

• Three 10-bit 350 MHz RAMDACs
• Single - channel LVDS
• 18-bit TTL

                                              Unified  Video Decoding Processor                                               

• MPEG-2/H.264 VLD hardware decoding acceleration
• MPEG-4, VC1 and DivX video decoding acceleration

                                              High  Definition Audio Interface                                               

• Supports up to 32-bit sample depth at 192 kHz sampling       rate
• Supports three codecs and eight streams
• Supports HD modem

                                              Video Capture   Port                                             

• One 16-bit input or
• One 8-bit TS input + one Serial TS input or
• CCIR656/601 input + one Serial TS input

                                              Supported  Software Standards                                              

• Microsoft® DirectX 9.0,
• Microsoft® Windows XP and Vista,       Win CE and Linux

                                              Power  Management                                               

• ACPI 3.0 and PCI Bus Power Management 1.1 compliant
• Snapshot extensive system power management

                                              Package                                               

• Flip-Chip Ball Grid Array (FCBGA)
• Package Size: 27 x 27mm/0.8mm

                                              Core  Voltage                                              

• 1.2V

VIA Eden® Processors - Low Power Fanless Processing                        With its signature fanless operation, the VIA Eden™ processor familytargets personal, business, industrial and commercial embeddedcomputing devices that require ultra low power consumption, rock solidreliability and compatibility with standard x86 operating systems andsoftware applications. VIA Eden processors are scalable from 400MHz to1.5GHz all within a maximum thermal envelope of 7.5 watts, and areavailable with a diverse range of feature sets that enable PCfunctionality and connectivity from traditionally single functiondevices.
                         The VIA Eden processor familyis available in nanoBGA, nanoBGA2 and EBGA packaging, using 150nm,130nm and the latest 90nm SOI manufacturing process to deliver leadingperformance per watt and in fully RoHS compliant packages.
Available Models                        Please click on the processor name for more information on each processor:
                                                    Process TechnologyProcessor NameCore ArchitectureClock Speed RangeFSBPackage/ Size 90nm  VIA Eden 'Esther'400MHz-1.2GHz400MHzNanoBGA2 21mmx21mm 90nm  VIA Eden ULV 'Esther'1.0GHz, 1.5GHz400MHzNanoBGA2 21mmx21mm 0.13um  VIA Eden-N 'Nehemiah'533MHz-1.0GHz133MHzNanoBGA 15mmx15mm 0.13um  VIA Eden ESP 'Nehemiah'667MHz-1.0GHz133MHzEBGA 35mmx35mm 0.15um  VIA Eden ESP'Samuel 2'300MHz-600MHz66/ 100/ 133MHzEBGA 35mmx35mm                        Pleasecontact your local VIA sales representative for information regardingavailability of VIA Eden processors, or send an email to VIA at mkt@via.com.tw
                      VIA Eden Processor Applications                        Thelow power consumption, excellent heat dissipation and leading powerefficiency makes the VIA Eden processor ideal for a wide range ofcompact, quiet devices for the home, office, car, shops, hospitals,public institutions, industrial plants and much, much more; below arejust some of the key applications in which the VIA Eden processor hasalready gained market momentum:
                                              Secure by Design                        VIA Eden processors are helping to herald an era of practical pervasive security thanks to the VIA PadLock Security Engine,the world's fastest x86 security engine in the world featuring the mostcomprehensive suite of tools for key cryptographic operations.
                        
                        Over the last couple of processor core generations, VIA has expandedthe hardware security suite integrated directly onto the processor die,starting with the world's best random number generator (RNG) and AESEncryption Engine in the C5P (Nehemiah) processor core to SHA-1 andSHA-256 hashing for secure message digests, and a hardware basedMontgomery Multiplier supporting key sizes up to 32K in length toaccelerate public key cryptography, such as RSA™ in the latest C5J(Esther) core. This latest generation also provides NX ExecuteProtection, providing protection from malicious software such as wormsand viruses, and is used in Microsoft® Windows® XP with SP2.Integrating security directly onto the processor die ensures speeds andefficiency many times that available in software, yet with negligibleimpact on processor performance.
                         Learn more...
                        VIA Eden Processors: Security Feature Comparison VIA Eden 0.13, 0.15µm VIA Eden 90nmBenefitsSecure Hash Full SHA-1 & SHA-256 20Gbps peak                                     World's fastest x86 Secure Hash engine                                    Data integrity and origin authentication in data transferVirus Protection NX Bit Protects against worm attacks and propagation EncryptionFull AES Encryption ECB, CBC, CFB, OFB hardware modes 25Gbps peak@2GHz +RSA hardware assist (Montgomery Multiplier)                                     World's fastest x86 encryption                                    Miltary-grade                                    Data encryption acceleration for RSA Public Key SecurityHardware RNG 2 hardware RGNs + enchanced performance
            + feeds to SHA                                     World's fastest x86 Quantum RNG                                    Superior to software based generation                                    World's heighest level of x86 based entropy                     







Moorestown平台，搭配全新的Lincroft处理器，芯片组则Langwell，Lincroft处理器集成了内存控制器和图形核心。

The Moorestown Update: Atom in Smartphones

The successor to Menlow is Moorestown. Also built on a 45nm process, Moorestown is a highly integrated version of Menlow composed of the following components:

    1) Lincroft System on a Chip (SoC)
    2) Langwell South Hub
    3) PMIC
    4) Evans Peak Networking

Moorestown is composed of two chips: a north hub and a south hub. The Lincroft SoC is the north hub and it features a LPIA (Low Power Intel Architecture) CPU core (Silverthorne derivative), on-die graphics and on-die memory controller. Both video encode and decode hardware are also included on-die. This is a big step from Menlow because the GPU is now built on a 45nm process since it’s contained on the CPU die itself. The on-die memory controller should also help performance of the in-order core which is highly dependent on receiving dependent data as quickly as possible.

The Langwell south hub is an extremely focused piece of silicon given how highly integrated the Lincroft north hub/CPU is. Langwell is composed of a system controller, solid state disk controller and I/O blocks for things like USB or audio.

The Power Management IC (PMIC) plays a mystery role at this point. Intel is just revealing that it handles power management for the platform yet not fully detailing its active roles. The PMIC interfaces with the Langwell south hub which is being licensed to 3rd parties to actually make the PMIC.

The final component of Moorestown is the Evans Peak networking hub, which is made up of Intel and non-Intel silicon. Intel will enable Wi-Fi, WiMAX, Bluetooth and GPS while 3rd party vendors can supply chips to enable things like 3G on Moorestown platforms.

As we mentioned before, Moorestown rids the platform of any PCI bus which apparently precludes it from being used with Windows Vista, because of this all Moorestown based MIDs will be running Linux. Linux is a far better fit for something like Menlow or Moorestown simply because the performance levels are too low to be used with a hog like Vista. Vista can work on these platforms, just not with iPhone-smoothness.

Thanks to the integration made possible with Moorestown idle power will be reduced by a factor of 10x over Menlow. With such a low idle power, voice applications now become possible with Moorestown.

Moorestown will allow Intel’s Atom CPU to exist in larger smart phones (4 - 5” size), while its successor in 2010/2011 will use the magic of Intel’s 32nm process to finally get into something iPhone-sized.