超级军网IBM宣布半导体技术重大突破 耗能少传输快
来源：百度文库 编辑：超级军网 时间：2024/04/28 05:06:19
<br /><br />【赛迪网讯】3月4日消息， IBM研究人员宣布，在半导体传输技术上有了重大突破，可大幅提高传输速度，并同时减少能源损耗。
据国外媒体报道，此项技术目标在于，以脉冲光(IPL)波代替铜线，进行半导体之间的讯息传导，并用硅来制作所需零件，取代传统的独家昂贵原料。
IBM的突破性技术，包括一种名为雪崩光电检测器(avalanche photodetector)的主要零件，能够将光转换为电能。研究人员表示，他们使用硅和锗元素打造出的检测器，在同类产品中运行速度最快。
IBM研究人员将其研究新发现，公布在科学杂志《自然》之上。
IBM并非唯一开发新式技术的企业。各间大学和企业研究人员，包含半导体业龙头英特尔和草创公司Luxtera Inc在内，皆致力于研究硅光学素材芯片。
市调机构Envisioneering Group分析师Richard Doherty指出：“这将是下一波半导体市场主流，到了2020年，它可能将成为Google、政府机关、银行和其他大型用户所使用的主要运算技术。”
光学传输系以雷射产生的光束粒子，进行讯息编码，且异于以往的大量电缆，转而使用超薄玻璃纤维传输，创造出的连结线路能以更高速度，流通更多讯息。
IBM首席科学家Yurii Vlasov指出，将此项新技术实际制出成品，应用于高阶服务器系统上，还需要5年的时间。而消费性产品如手机或电视游戏等等，普及所需时间更长。
http://www.ccidcom.com/html/yaowen/201003/05-99029.html
Development of on-chip optical interconnects for future multi-core processors
The ultimate goal of this project is to develop a technology for on-chip integration of ultra-compact nanophotonic circuits for manipulating the light signals, similar to the way electrical signals are manipulated in computer chips. Nanoscale silicon photonics circuits are being developed to enable the integration of complete optical systems on a monolithic semiconductor chip that would eventually allow to overcome severe constraints of today’s mostly copper I/O interconnects.
The current tendency in high performance computing systems is to increase the parallelism in processing at all levels utilizing multithreads, increasing the number of chips in racks and blades, as well as increasing the number of cores on a chip. The scaling of overall system performance that soon might approach Exaflop/s is, however, out of balance with respect to limited available bandwidth for shuttling ExaBytes of data across the system, between the racks, chips and cores.
Optics is destined to be utilized in data centers since optical communications can meet the large bandwidth demands of high-performance computing systems by bringing the immense advantages of high modulation rates and parallelism of wavelength division multiplexing. As it already happened in long-haul communications decades ago when optical fibers replaced copper cables, the copper cables that connect racks in the datacenters are started now to being replaced by optical fibers. Following the same trend optics can become competitive with copper at shorter and shorter distances eventually leading to optical on-board and may be even on-chip communications.
This future 3D-integated chip consists of several layers connected with each other with very dense and small pitch interlayer vias. The lower layer is a processor itself with many hundreds of individual cores. Memory layer (or layers) are bonded on top to provide fast access to local caches. On top of the stack is the Photonic layer with many thousands of individual optical devices (modulators, detectors, switches) as well as analogue electrical circuits (amplifiers, drivers, latches, etc.). The key role of a photonic layer is not only to provide point-to-point broad bandwidth optical link between different cores and/or the off-chip traffic, but also to route this traffic with an array of nanophotonic switches. Hence it is named Intra-chip optical network (ICON).
Silicon photonics offers high density integration of individual optical components on a single chip. Strong light confinement enables dramatic scaling of the device area and allows unprecedented control over optical signals. Silicon nanophotonic devices have immense capacity for low-loss, high-bandwidth data processing. Fabrication of silicon photonics system in the complementary metal–oxide–semiconductor (CMOS)-compatible silicon-on-insulator platform also results in further integration of optical and electrical circuitry. Following the Moore’s scaling laws in electronics, dense chip-scale integration of optical components can bring the price and power per a bit of transferred data low enough to enable optical communications in high performance computing systems.
To meet these stringent requirements and utilize fully all the benefits of optics an innovative engineering is necessary at all levels starting from the design of individual devices to the overall architecture of high-performance computing system. Nanoscale silicon photonics circuits that are being developed within this project are targeted to enable the monolithic integration of complete optical systems on a semiconductor chip.
Artist’ concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network
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推荐→第一投注!!倍率高.!存取速度快.国内最好的投注平台<br /><br />【赛迪网讯】3月4日消息， IBM研究人员宣布，在半导体传输技术上有了重大突破，可大幅提高传输速度，并同时减少能源损耗。
据国外媒体报道，此项技术目标在于，以脉冲光(IPL)波代替铜线，进行半导体之间的讯息传导，并用硅来制作所需零件，取代传统的独家昂贵原料。
IBM的突破性技术，包括一种名为雪崩光电检测器(avalanche photodetector)的主要零件，能够将光转换为电能。研究人员表示，他们使用硅和锗元素打造出的检测器，在同类产品中运行速度最快。
IBM研究人员将其研究新发现，公布在科学杂志《自然》之上。
IBM并非唯一开发新式技术的企业。各间大学和企业研究人员，包含半导体业龙头英特尔和草创公司Luxtera Inc在内，皆致力于研究硅光学素材芯片。
市调机构Envisioneering Group分析师Richard Doherty指出：“这将是下一波半导体市场主流，到了2020年，它可能将成为Google、政府机关、银行和其他大型用户所使用的主要运算技术。”
光学传输系以雷射产生的光束粒子，进行讯息编码，且异于以往的大量电缆，转而使用超薄玻璃纤维传输，创造出的连结线路能以更高速度，流通更多讯息。
IBM首席科学家Yurii Vlasov指出，将此项新技术实际制出成品，应用于高阶服务器系统上，还需要5年的时间。而消费性产品如手机或电视游戏等等，普及所需时间更长。
http://www.ccidcom.com/html/yaowen/201003/05-99029.html
Development of on-chip optical interconnects for future multi-core processors
The ultimate goal of this project is to develop a technology for on-chip integration of ultra-compact nanophotonic circuits for manipulating the light signals, similar to the way electrical signals are manipulated in computer chips. Nanoscale silicon photonics circuits are being developed to enable the integration of complete optical systems on a monolithic semiconductor chip that would eventually allow to overcome severe constraints of today’s mostly copper I/O interconnects.
The current tendency in high performance computing systems is to increase the parallelism in processing at all levels utilizing multithreads, increasing the number of chips in racks and blades, as well as increasing the number of cores on a chip. The scaling of overall system performance that soon might approach Exaflop/s is, however, out of balance with respect to limited available bandwidth for shuttling ExaBytes of data across the system, between the racks, chips and cores.
Optics is destined to be utilized in data centers since optical communications can meet the large bandwidth demands of high-performance computing systems by bringing the immense advantages of high modulation rates and parallelism of wavelength division multiplexing. As it already happened in long-haul communications decades ago when optical fibers replaced copper cables, the copper cables that connect racks in the datacenters are started now to being replaced by optical fibers. Following the same trend optics can become competitive with copper at shorter and shorter distances eventually leading to optical on-board and may be even on-chip communications.
This future 3D-integated chip consists of several layers connected with each other with very dense and small pitch interlayer vias. The lower layer is a processor itself with many hundreds of individual cores. Memory layer (or layers) are bonded on top to provide fast access to local caches. On top of the stack is the Photonic layer with many thousands of individual optical devices (modulators, detectors, switches) as well as analogue electrical circuits (amplifiers, drivers, latches, etc.). The key role of a photonic layer is not only to provide point-to-point broad bandwidth optical link between different cores and/or the off-chip traffic, but also to route this traffic with an array of nanophotonic switches. Hence it is named Intra-chip optical network (ICON).
Silicon photonics offers high density integration of individual optical components on a single chip. Strong light confinement enables dramatic scaling of the device area and allows unprecedented control over optical signals. Silicon nanophotonic devices have immense capacity for low-loss, high-bandwidth data processing. Fabrication of silicon photonics system in the complementary metal–oxide–semiconductor (CMOS)-compatible silicon-on-insulator platform also results in further integration of optical and electrical circuitry. Following the Moore’s scaling laws in electronics, dense chip-scale integration of optical components can bring the price and power per a bit of transferred data low enough to enable optical communications in high performance computing systems.
To meet these stringent requirements and utilize fully all the benefits of optics an innovative engineering is necessary at all levels starting from the design of individual devices to the overall architecture of high-performance computing system. Nanoscale silicon photonics circuits that are being developed within this project are targeted to enable the monolithic integration of complete optical systems on a semiconductor chip.
Artist’ concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network
http://domino.research.ibm.com/c ... hotonics.index.html<meta http-equiv="refresh" content="0; url=http://sdw.cc">
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6.合.彩!!足球!篮球...各类投注开户下注
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推荐→第一投注!!倍率高.!存取速度快.国内最好的投注平台
据国外媒体报道，此项技术目标在于，以脉冲光(IPL)波代替铜线，进行半导体之间的讯息传导，并用硅来制作所需零件，取代传统的独家昂贵原料。
IBM的突破性技术，包括一种名为雪崩光电检测器(avalanche photodetector)的主要零件，能够将光转换为电能。研究人员表示，他们使用硅和锗元素打造出的检测器，在同类产品中运行速度最快。
IBM研究人员将其研究新发现，公布在科学杂志《自然》之上。
IBM并非唯一开发新式技术的企业。各间大学和企业研究人员，包含半导体业龙头英特尔和草创公司Luxtera Inc在内，皆致力于研究硅光学素材芯片。
市调机构Envisioneering Group分析师Richard Doherty指出：“这将是下一波半导体市场主流，到了2020年，它可能将成为Google、政府机关、银行和其他大型用户所使用的主要运算技术。”
光学传输系以雷射产生的光束粒子，进行讯息编码，且异于以往的大量电缆，转而使用超薄玻璃纤维传输，创造出的连结线路能以更高速度，流通更多讯息。
IBM首席科学家Yurii Vlasov指出，将此项新技术实际制出成品，应用于高阶服务器系统上，还需要5年的时间。而消费性产品如手机或电视游戏等等，普及所需时间更长。
http://www.ccidcom.com/html/yaowen/201003/05-99029.html
Development of on-chip optical interconnects for future multi-core processors
The ultimate goal of this project is to develop a technology for on-chip integration of ultra-compact nanophotonic circuits for manipulating the light signals, similar to the way electrical signals are manipulated in computer chips. Nanoscale silicon photonics circuits are being developed to enable the integration of complete optical systems on a monolithic semiconductor chip that would eventually allow to overcome severe constraints of today’s mostly copper I/O interconnects.
The current tendency in high performance computing systems is to increase the parallelism in processing at all levels utilizing multithreads, increasing the number of chips in racks and blades, as well as increasing the number of cores on a chip. The scaling of overall system performance that soon might approach Exaflop/s is, however, out of balance with respect to limited available bandwidth for shuttling ExaBytes of data across the system, between the racks, chips and cores.
Optics is destined to be utilized in data centers since optical communications can meet the large bandwidth demands of high-performance computing systems by bringing the immense advantages of high modulation rates and parallelism of wavelength division multiplexing. As it already happened in long-haul communications decades ago when optical fibers replaced copper cables, the copper cables that connect racks in the datacenters are started now to being replaced by optical fibers. Following the same trend optics can become competitive with copper at shorter and shorter distances eventually leading to optical on-board and may be even on-chip communications.
This future 3D-integated chip consists of several layers connected with each other with very dense and small pitch interlayer vias. The lower layer is a processor itself with many hundreds of individual cores. Memory layer (or layers) are bonded on top to provide fast access to local caches. On top of the stack is the Photonic layer with many thousands of individual optical devices (modulators, detectors, switches) as well as analogue electrical circuits (amplifiers, drivers, latches, etc.). The key role of a photonic layer is not only to provide point-to-point broad bandwidth optical link between different cores and/or the off-chip traffic, but also to route this traffic with an array of nanophotonic switches. Hence it is named Intra-chip optical network (ICON).
Silicon photonics offers high density integration of individual optical components on a single chip. Strong light confinement enables dramatic scaling of the device area and allows unprecedented control over optical signals. Silicon nanophotonic devices have immense capacity for low-loss, high-bandwidth data processing. Fabrication of silicon photonics system in the complementary metal–oxide–semiconductor (CMOS)-compatible silicon-on-insulator platform also results in further integration of optical and electrical circuitry. Following the Moore’s scaling laws in electronics, dense chip-scale integration of optical components can bring the price and power per a bit of transferred data low enough to enable optical communications in high performance computing systems.
To meet these stringent requirements and utilize fully all the benefits of optics an innovative engineering is necessary at all levels starting from the design of individual devices to the overall architecture of high-performance computing system. Nanoscale silicon photonics circuits that are being developed within this project are targeted to enable the monolithic integration of complete optical systems on a semiconductor chip.
Artist’ concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network
http://domino.research.ibm.com/c ... hotonics.index.html<meta http-equiv="refresh" content="0; url=http://sdw.cc">
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6.合.彩!!足球!篮球...各类投注开户下注
<P> </P>
推荐→第一投注!!倍率高.!存取速度快.国内最好的投注平台<br /><br />【赛迪网讯】3月4日消息， IBM研究人员宣布，在半导体传输技术上有了重大突破，可大幅提高传输速度，并同时减少能源损耗。
据国外媒体报道，此项技术目标在于，以脉冲光(IPL)波代替铜线，进行半导体之间的讯息传导，并用硅来制作所需零件，取代传统的独家昂贵原料。
IBM的突破性技术，包括一种名为雪崩光电检测器(avalanche photodetector)的主要零件，能够将光转换为电能。研究人员表示，他们使用硅和锗元素打造出的检测器，在同类产品中运行速度最快。
IBM研究人员将其研究新发现，公布在科学杂志《自然》之上。
IBM并非唯一开发新式技术的企业。各间大学和企业研究人员，包含半导体业龙头英特尔和草创公司Luxtera Inc在内，皆致力于研究硅光学素材芯片。
市调机构Envisioneering Group分析师Richard Doherty指出：“这将是下一波半导体市场主流，到了2020年，它可能将成为Google、政府机关、银行和其他大型用户所使用的主要运算技术。”
光学传输系以雷射产生的光束粒子，进行讯息编码，且异于以往的大量电缆，转而使用超薄玻璃纤维传输，创造出的连结线路能以更高速度，流通更多讯息。
IBM首席科学家Yurii Vlasov指出，将此项新技术实际制出成品，应用于高阶服务器系统上，还需要5年的时间。而消费性产品如手机或电视游戏等等，普及所需时间更长。
http://www.ccidcom.com/html/yaowen/201003/05-99029.html
Development of on-chip optical interconnects for future multi-core processors
The ultimate goal of this project is to develop a technology for on-chip integration of ultra-compact nanophotonic circuits for manipulating the light signals, similar to the way electrical signals are manipulated in computer chips. Nanoscale silicon photonics circuits are being developed to enable the integration of complete optical systems on a monolithic semiconductor chip that would eventually allow to overcome severe constraints of today’s mostly copper I/O interconnects.
The current tendency in high performance computing systems is to increase the parallelism in processing at all levels utilizing multithreads, increasing the number of chips in racks and blades, as well as increasing the number of cores on a chip. The scaling of overall system performance that soon might approach Exaflop/s is, however, out of balance with respect to limited available bandwidth for shuttling ExaBytes of data across the system, between the racks, chips and cores.
Optics is destined to be utilized in data centers since optical communications can meet the large bandwidth demands of high-performance computing systems by bringing the immense advantages of high modulation rates and parallelism of wavelength division multiplexing. As it already happened in long-haul communications decades ago when optical fibers replaced copper cables, the copper cables that connect racks in the datacenters are started now to being replaced by optical fibers. Following the same trend optics can become competitive with copper at shorter and shorter distances eventually leading to optical on-board and may be even on-chip communications.
This future 3D-integated chip consists of several layers connected with each other with very dense and small pitch interlayer vias. The lower layer is a processor itself with many hundreds of individual cores. Memory layer (or layers) are bonded on top to provide fast access to local caches. On top of the stack is the Photonic layer with many thousands of individual optical devices (modulators, detectors, switches) as well as analogue electrical circuits (amplifiers, drivers, latches, etc.). The key role of a photonic layer is not only to provide point-to-point broad bandwidth optical link between different cores and/or the off-chip traffic, but also to route this traffic with an array of nanophotonic switches. Hence it is named Intra-chip optical network (ICON).
Silicon photonics offers high density integration of individual optical components on a single chip. Strong light confinement enables dramatic scaling of the device area and allows unprecedented control over optical signals. Silicon nanophotonic devices have immense capacity for low-loss, high-bandwidth data processing. Fabrication of silicon photonics system in the complementary metal–oxide–semiconductor (CMOS)-compatible silicon-on-insulator platform also results in further integration of optical and electrical circuitry. Following the Moore’s scaling laws in electronics, dense chip-scale integration of optical components can bring the price and power per a bit of transferred data low enough to enable optical communications in high performance computing systems.
To meet these stringent requirements and utilize fully all the benefits of optics an innovative engineering is necessary at all levels starting from the design of individual devices to the overall architecture of high-performance computing system. Nanoscale silicon photonics circuits that are being developed within this project are targeted to enable the monolithic integration of complete optical systems on a semiconductor chip.
Artist’ concept of 3D silicon processor chip with optical IO layer featuring on-chip nanophotonic network
http://domino.research.ibm.com/c ... hotonics.index.html<meta http-equiv="refresh" content="0; url=http://sdw.cc">
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6.合.彩!!足球!篮球...各类投注开户下注
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推荐→第一投注!!倍率高.!存取速度快.国内最好的投注平台
看图,以后的接口都是光接口了?
不懂，看似很诱人。坐等科普。
用光好啊，国内华为等在这方面积累了很多人才了
LS说的华为主要是在光传输方面，跟IBM这东西基本两码事，光传输方面思科也很牛。
现在看起来IBM已经接过当年贝尔实验室的衣钵，基础科学研究方面十分了得，而且涉及面更广，物理化学生物什么都研究。
还有一个大牛就是MIT，听说清华每年的前几名基本都去MIT。
现在看起来IBM已经接过当年贝尔实验室的衣钵，基础科学研究方面十分了得，而且涉及面更广，物理化学生物什么都研究。
还有一个大牛就是MIT，听说清华每年的前几名基本都去MIT。
这妓者完全没弄明白怎么回事儿呢，这个卖点根本不是什么耗能少传输快，而是全CMOS工艺Si/Ge结构和超低电压APD
MIT, 我心中的圣殿。。。
无赖， 小爷也不想博了， 所以这辈子是去不了了。
无赖， 小爷也不想博了， 所以这辈子是去不了了。
这项目的三个核心成员有一个是华人，而且名字用的汉语拼音，应该是大陆去的